INTEGRATED CIRCUITS
DATA SHEET
TDA1556Q
2 x 22 W stereo BTL differential
amplifier with speaker protection
and dynamic distortion detector
July 1994
Product specification
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic
TDA1556Q
V
P
5
13
1
2
mute switch
input 1A
input 1B
6
VA
output 1A
mute switch
8
VA
output 1B
4
DDD
14
mute/stand-by
stand-by
switch
stand-by
reference
voltage
V
A
15
LSP
n.c.
mute
switch
x1
TDA1556Q
9
16
17
mute switch
input 2A
input 2B
10
VA
output 2A
mute switch
12
VA
output 2B
3
n.c.
11
7
MLA383-2
powerground
Fig.1 Block diagram.
3
July 1994
Philips Semiconductors
Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic
TDA1556Q
PINNING
SYMBOL
IN1A
PIN
DESCRIPTION
input signal 1A
1
2
3
4
5
6
7
8
9
handbook, halfpage
IN 1A
IN 1B
n.c.
1
2
IN1B
n.c.
input signal 1B
not connected
3
DDD
dynamic distortion detector
positive supply voltage 1
output signal 1A
Vp1
DDD
4
OUT1A
GND1
OUT1B
n.c.
V
5
P1
power ground 1
OUT 1A
6
output signal 1B
GND 1
OUT 1B
n.c.
7
not connected
8
OUT2A
GND2
OUT2B
VP2
10 output signal 2A
11 power ground 2
9
TDA1556Q
10
OUT 2A
12 output signal 2B
13 positive supply voltage 2
14 mute/stand-by switch
15 loudspeaker protection
16 input signal 2B
GND 2 11
M/SB
LSP
12
OUT 2B
V
13
14
P2
IN2A
IN2B
M/SB
17 input signal 2A
LSP 15
IN 2A 16
IN 2B 17
MLA381 - 1
Fig.2 Pin configuration.
THERMAL RESISTANCE
output 1
output 2
THERMAL
handbook, halfpage
virtual
junction
SYMBOL
PARAMETER
RESISTANCE
2.8
K/W
2.8
K/W
Rth j-a
from junction to ambient
in free air
40 K/W
Rth j-c
from junction to case
(see Figs 3 and 4)
1.5 K/W
0.1
K/W
MLA382
case
Fig.3 Thermal resistance.
July 1994
4
Philips Semiconductors
Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic
TDA1556Q
FUNCTIONAL DESCRIPTION
Loudspeaker protection
The TDA1556Q contains two identical amplifiers each with
a fixed gain of 26 dB and differential input stages.
The device can be used for bridge-tied-load applications.
The circuit has the following features:
Should a short circuit to ground occur, thereby forcing a
DC voltage ≥ 1 V across the loudspeaker, a built-in
protection circuit is activated to limit the DC voltage across
the speaker to ≤ 1 V. The delay time of the protection
circuit can be influenced by the external capacitor
connected to pin 15.
• low stand-by current (< 100 µA)
• low mute/stand-by switching current (low cost supply
switch)
A dynamic distortion detector (DDD) is activated when
clipping occurs at one or both output stages. Its
information may be used to operate a sound processor or
DC volume control to attenuate the input signal, thereby
minimizing the distortion.
• mute facility
LIMITING VALUES
In accordance with the absolute maximum system (IEC 134)
SYMBOL
VP
PARAMETER
positive supply voltage
CONDITION
MIN.
MAX.
UNIT
operating
−
−
−
18
V
V
V
non-operating
30
45
during 50 ms (load
dump protection);
rise time ≥ 2.5 ms
IOSM
IORM
Tstg
Tvj
non-repetitive peak output current
repetitive peak output current
storage temperature range
virtual junction temperature
AC and DC short-circuit safe voltage
energy handling capability at outputs
reverse polarity
−
−
−55
−
−
−
6
A
A
4
+150
+150
18
°C
°C
V
Vpsc
VP = 0
200
6
mJ
V
Vpr
−
Ptot
total power dissipation
−
60
W
DC CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; unless otherwise specified
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VP
IP
positive supply voltage
quiescent current
note 1
6.0
−
−
14.4
80
18
V
160
−
mA
V
VO
Vos
DC output voltage
note 2
6.9
−
DC output offset voltage
operating
−
100
mV
Mute/stand-by
VON
switch-on voltage level
8.5
−
−
V
July 1994
5
Philips Semiconductors
Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic
TDA1556Q
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
MUTE CONDITION
Vmute
VO
mute voltage
3.3
−
−
−
6.4
V
output signal in mute position
DC output offset voltage
VI max = 1 V; f = 1 kHz
−
−
2
mV
mV
Vos
100
STANDBY CONDITION
Vsb
Isb
stand-by voltage
0
−
−
−
25
10
2
V
DC standby current
V14 < 0.5 V
−
−
−
−
100
500
60
-
µA
µA
µA
mA
0.5 V ≤ V14 ≤ 2.0 V
Isw
switch-on current
supply current
IPSC
short-circuit to ground;
note 3
Loudspeaker protection
∆V6-8, 10-12 DC voltage across RL
−
−
−
0.5
1.0
V
s
td
delay time
−
Protection active ( ∆V4-6 or ∆V7-9 ≤1.0 V
I15
current information
voltage information
−
3.6
25
−
−
µA
V
V15
−
Protection inactive ( ∆V6-8 and ∆V10-12 ≤0.1 V)
V15 voltage information
Notes to the characteristics
−
−
0.3
V
1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V
2. At 18 V < VP < 30 V the DC output voltage ≤ VP/2
3. Conditions: V14 = 0 V; short circuit to ground; switch V14 to MUTE or ON condition, rise time at V14 = ≥ 10 µs
4. Frequency response externally fixed
5. Ripple rejection measured at the output with a source-impedance of 0 Ω (maximum ripple amplitude of 2 V) and a
frequency between 100 Hz and 10 kHz
6. Mismatching is given by the following equation:
Z
i1 – Z
∆ Zi
=
=
i2 × 100°⁄
--------------------
Zi1
°
Z
i3 – Z
∆ Zi
i4 × 100°⁄
--------------------
Zi3
°
7. Noise measured in a bandwidth of 20 Hz to 20 kHz
8. Noise output voltage independent of RS (VI = 0 V)
9. Common mode rejection ratio measured at the output with both inputs tied together. VI(RMS) < 3.5 V;
f = 100 Hz - 10 kHz
July 1994
6
Philips Semiconductors
Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic
TDA1556Q
AC CHARACTERISTICS
Vp = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; unless otherwise specified
SYMBOL
PO
PARAMETER
output power
CONDITION
THD = 0.5%
MIN.
15
TYP.
17
MAX.
UNIT
−
W
THD = 10%
20
22
12
−
−
W
W
THD = 0.5%;
VP = 13.2 V
−
THD = 10%;
VP = 13.2 V
−
17
−
W
THD
B
total harmonic distortion
power bandwidth
PO = 1 W
−
−
0.1
−
−
%
THD = 0.5%;
PO = −1 dB; with
respect to 15 W
20 to
15000
Hz
fl
low frequency roll-off
−1 dB; note 4
−1 dB
−
20
25
25
−
−
−
Hz
fh
high frequency roll-off
kHz
dB
Gv
closed loop voltage gain
supply voltage ripple rejection
26
27
SVRR
note 5
ON condition
MUTE condition
stand-by condition
48
48
80
100
−
−
−
−
120
4
−
−
−
150
−
dB
dB
dB
kΩ
%
Zi
∆Zi
Vno
input impedance
input impedance
noise output voltage
note 6
ON: Rs = 0 Ω; note 7
ON: Rs = 10 kΩ;
note 7
−
−
70
100
120
−
µV
µV
MUTE: Rs = 10 kΩ;
notes 7 and 8
−
60
−
µV
α
channel separation
Rs = 10 kΩ
40
−
64
−
−
−
72
3.5
−
1
dB
dB
dB
%
∆Gv
CMRR
THD
channel unbalance
common mode rejection ratio
total harmonic distortion
note 9
−
−
IDDD = 50 µA (peak)
July 1994
7
Philips Semiconductors
Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic
TDA1556Q
mute/stand-by
V
DDD
4
P
2200
µF
100
nF
14
5
13
1/2 R
220 nF
s
1
6
Z
Z
i1
i2
audio
source
R
load
8
220 µF
1/2 R
s
2
9
n.c.
V
ref
15
4.7
µF
n.c.
3
TDA1556Q
1/2 R
220 nF
s
16
10
Z
Z
i3
audio
source
R
load
i4
12
220 µF
1/2 R
s
17
7
11
MLA380-2
Fig.4 Stereo BTL test diagram.
8
July 1994
Philips Semiconductors
Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic
TDA1556Q
PACKAGE OUTLINE
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
SOT243-1
non-concave
D
h
x
D
E
h
view B: mounting base side
d
A
2
B
j
E
A
L
3
L
Q
c
1
17
e
e
m
v
M
w
M
1
Z
2
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
UNIT
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0
15.5 4.2 0.60 0.38 23.6 19.6
12.2
11.8
3.4 12.4 2.4
3.1 11.0 1.6
2.00
1.45
2.1
1.8
6
mm
10
2.54 1.27 5.08
0.8
4.3
0.4 0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-03-11
SOT243-1
July 1994
9
Philips Semiconductors
Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic
TDA1556Q
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 1994
10
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